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South Korean semiconductor company SEMIFIVE has signed a turnkey development contract with AI semiconductor company Mobilint to develop an artificial intelligence chip for robotics
applications.
The project is part of South Korea's government-backed K-On-Device AI Semiconductor Technology Development Programme, which supports the development and validation of AI chips designed for specific industry applications.
The companies said the chip is being designed to perform high-performance AI computing directly on robotic systems, including in outdoor environments where connectivity to external servers may be limited.
The technology is expected to be used in applications such as agricultural robots, where the chip will process vision and sensor data in real time under different operating conditions.
SEMIFIVE will develop the chip under its Spec Hand-off model, in which customers provide key performance requirements and specifications while SEMIFIVE manages the development process from detailed chip design through packaging, testing and mass production.
The chip will incorporate technologies including LPDDR6 memory, PCIe Gen6 and UCIe-S, which are designed to provide high-speed data transfer and connectivity between different components within the system. The companies said these technologies are intended to support power efficiency and stable operation in environments where network connectivity may be limited.
The project expands SEMIFIVE's work beyond data-centre, high-performance computing and edge AI applications into robotics and physical AI.
The agreement also forms part of South Korea's broader effort to develop domestic AI semiconductor capabilities and move AI processing closer to devices. Mobilint was already participating in several projects under the same government programme with LG Electronics, Doosan Robotics and Daedong, including projects involving humanoid, collaborative and agricultural robots.
The project is part of South Korea's government-backed K-On-Device AI Semiconductor Technology Development Programme, which supports the development and validation of AI chips designed for specific industry applications.
The companies said the chip is being designed to perform high-performance AI computing directly on robotic systems, including in outdoor environments where connectivity to external servers may be limited.
The technology is expected to be used in applications such as agricultural robots, where the chip will process vision and sensor data in real time under different operating conditions.
SEMIFIVE will develop the chip under its Spec Hand-off model, in which customers provide key performance requirements and specifications while SEMIFIVE manages the development process from detailed chip design through packaging, testing and mass production.
The chip will incorporate technologies including LPDDR6 memory, PCIe Gen6 and UCIe-S, which are designed to provide high-speed data transfer and connectivity between different components within the system. The companies said these technologies are intended to support power efficiency and stable operation in environments where network connectivity may be limited.
The project expands SEMIFIVE's work beyond data-centre, high-performance computing and edge AI applications into robotics and physical AI.
The agreement also forms part of South Korea's broader effort to develop domestic AI semiconductor capabilities and move AI processing closer to devices. Mobilint was already participating in several projects under the same government programme with LG Electronics, Doosan Robotics and Daedong, including projects involving humanoid, collaborative and agricultural robots.
